Technology / WORLD

ASML and TSMC target a 12-inch photomask pilot line by 2031

The initiative seeks a larger mask format for High NA EUV lithography

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ASML and TSMC said they formed an industry initiative on 7 September to support a transition to 12-inch photomasks. The semiconductor industry has long relied on 6-inch masks; the partners say a larger format could support the use of High NA EUV lithography.

The companies target a 12-inch mask pilot line by 2031 and readiness of lithography systems for advanced-node production by 2033. These are industry-wide partner targets, not a Dutch production line or completed capacity.

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ASML and TSMC initiative for 12-inch photomasks, announced milestones

Company targets for an industry initiative; the pilot line and system readiness are future milestones

12-inch photomask pilot lineTargeted by 2031
Lithography system readiness for advanced-node productionTargeted by 2033
Methodology

Targets from ASML and TSMC’s September 2026 announcement for a global industry initiative; these are future milestones.

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  • Netherlands · Place role: Coverage · Place type: Country or area · Location precision: Regional
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