NVIDIA and Cisco plan optical module for AI factories
The USFP optical module format targets higher connectivity capacity in AI factories. The companies specify 400 Gb/s lanes and up to 12.8 Tb/s total capacity.
Event / data period: 2026-10-12
Published: · Updated:

NVIDIA and Cisco announced plans on October 12 for an optical module format called Ultra-Dense Small Form Factor Pluggable (USFP). Initial modules are planned to carry 16 full-duplex lanes in an OSFP-sized footprint.
The companies target four times the bandwidth density and about 1.3 times the power efficiency of 200 Gb/s-per-lane modules. Products and an open multi-source industry specification remain planned; the announcement reports no field results.
Data
Plan announcement
NVIDIA and Cisco announced a plan for 400 Gb/s-per-lane USFP modules.
- · Occurred
NVIDIA and Cisco plan optical module for AI factories
NVIDIA and Cisco announced a plan for 400 Gb/s-per-lane USFP modules.
Methodology
This block records NVIDIA and Cisco’s October 12, 2026 announcement. Capacity and efficiency figures are planned design specifications and company comparisons, not performance of products already in market.
Updated:
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