Micron selects Bechtel for first-phase New York fab EPC
The US semiconductor investment advances its engineering, procurement and construction work.
Event / data period: 2026-06-10
Published: · Updated:
IllustrationBechtel’s June 10 announcement identifies it as Micron’s EPC partner for the first phase of the Clay, New York memory campus. Mobilisation at White Pine was planned.
The announcement concerns integrated EPC delivery; a contract price is not reported here. Cleanrooms, precise process infrastructure and electrical systems make coordinated planning a central technical issue for semiconductor construction.