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Infineon and Wolfspeed agree on 200 mm SiC wafer supply

The agreement supports Infineon’s transition from existing 150 mm silicon-carbide wafers to a larger diameter.

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Infineon said on October 15 that it had signed a multi-year supply agreement with Wolfspeed for 200 mm silicon-carbide (SiC) wafers. The company said the deal expands its existing 150 mm wafer supply as it transitions to the larger diameter.

SiC is a material used in power semiconductors; wafer diameter alone does not establish manufacturing yield or cost outcomes. The announcement describes the supply transition but does not disclose volumes or financial terms.

Data

Timeline

Infineon and Wolfspeed agree on 200 mm SiC wafer supply

The agreement supports Infineon’s transition from existing 150 mm silicon-carbide wafers to a larger diameter.

  1. · Occurred

    Infineon and Wolfspeed agree on 200 mm SiC wafer supply

    The agreement supports Infineon’s transition from existing 150 mm silicon-carbide wafers to a larger diameter.

Methodology

Agreement and wafer diameters are from the company’s October 15 release. The announcement does not disclose supply volumes or pricing.

Updated:

Table

Key fact in announcement

The central source-reported point is provided as a translated text cell.

The agreement supports Infineon’s transition from existing 150 mm silicon-carbide wafers to a larger diameter.
Methodology

The text summarizes the source announcement; it adds no quantitative result or independent validation.

Updated:

Table

SiC wafer-diameter transition

Nominal wafer diameters for the existing supply and new agreement.

Existing supply150
New agreement200
Methodology

Diameters are from the company announcement; no yield or cost outcome is inferred.

Updated:

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