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FormFactor and Teradyne announce semiconductor-test collaboration

Teradyne also agreed to a $300 million strategic investment in FormFactor, subject to closing conditions and approvals.

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FormFactor and Teradyne announced a technology collaboration to advance semiconductor test architectures for advanced packaging, high-bandwidth memory, silicon photonics and high-performance computing. FormFactor’s probing, interface and characterization expertise will be combined with Teradyne’s automated test platforms.

Teradyne separately agreed to make a $300 million strategic equity investment in FormFactor. The collaboration aims to support production readiness and shared customer work; the investment remains subject to customary closing conditions and regulatory approvals.

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FormFactor and Teradyne will combine test expertise for advanced packaging, HBM, silicon photonics and HPC.

The investment is subject to closing conditions and regulatory approvals.

  1. · Occurred

    FormFactor and Teradyne will combine test expertise for advanced packaging, HBM, silicon photonics and HPC.

    The investment is subject to closing conditions and regulatory approvals.

Methodology

This event record summarizes the primary announcement; it is not independent verification of product performance.

Updated:

Table

FormFactor and Teradyne will combine test expertise for advanced packaging, HBM, silicon photonics and HPC.

The investment is subject to closing conditions and regulatory approvals.

Equity investment subject to closing conditions and regulatory approvals300
Methodology

This event record summarizes the primary announcement; it is not independent verification of product performance.

Updated:

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