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SiPearl and Egis partner on Arm-based Mobius100 server CPU platform

The European and Taiwanese companies will develop a CPU chiplet platform for AI and high-performance computing, with engineering samples targeted for 2027.

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France-based SiPearl and Taiwan-based Egis Group announced strategic cooperation and investment agreements for the Mobius100 platform on 22 October. They describe it as an Arm Neoverse V3-based server CPU being developed jointly by Alcor Micro and SiPearl.

The companies said the agreement provides a basis for technology and go-to-market cooperation between Europe and Taiwan. Work will continue to align the platform with customer and system requirements and to develop business opportunities.

Mobius100 is designed as a chiplet platform for artificial intelligence, high-performance computing and data-centre systems. The release says it integrates UCIe 2.0 intellectual property and is based on TSMC’s N3P process.

The companies’ product description lists a dual-die package with 140 cores, including 12 redundant cores, and eight UCIe 2.0-S chiplet interfaces. These are announced design specifications; the release provides no independent performance benchmark or energy-efficiency comparison.

Egis and SiPearl currently target engineering samples in 2027 and volume production in the second half of 2028. They say the schedule depends on product development, validation and customer requirements.

SiPearl says it will use the Mobius100 architecture for Rhea2, its second-generation CPU. The announcement gives no firm commitment on customer acceptance, commercial orders or a volume-production date for Rhea2.

The release describes a dual-die package with 140 CPU cores, including 12 redundant cores, and support for high-bandwidth DDR5-12800 MRDIMM memory. It also lists eight UCIe 2.0-S chiplet interfaces. These are platform specifications disclosed by the companies; the announcement does not provide measured performance, power consumption or benchmark comparisons against competing processors.

The platform also includes Arm Scalable Vector Extension 2 processing and a Caliptra 2.0-based hardware root of trust, alongside Arm Confidential Compute Architecture and Realm Management Extension security capabilities. The press release says coherent connections between CPUs and between CPUs and accelerators, as well as PCIe Gen6 and CXL expansion, are intended to support large computing systems.

SiPearl says it will use the Mobius100 architecture for Rhea2, its second-generation high-performance CPU for HPC, AI, cloud-service providers and data centres. The company describes Rhea2 as planned for launch shortly after Mobius100, but the joint release gives no separate launch date or committed shipment volume for that product.

The companies frame the partnership as complementary: SiPearl brings CPU design and knowledge of European HPC markets, while Egis Group and its Alcor Micro subsidiary contribute chiplet and design services. The agreement calls for continued alignment with customer and system requirements and exploration of next-generation CPU platforms; it does not announce a disclosed purchase order or named customer.

Data

Table

Announced package and interface specifications for Mobius100

Core and UCIe interface counts in the product summary of the SiPearl-Egis release.

CPU cores in dual-die package140
Redundant cores included in total12
UCIe 2.0-S chiplet interfaces8
Methodology

Values are company-announced design specifications, not performance results or independently verified production data.

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