Aeluma signs CHIPS letter of intent for up to $30 million in AI photonics
California-based semiconductor company Aeluma said it signed a letter of intent for up to $30 million with the Commerce Department’s CHIPS R&D Office.
Event / data period: 2026-09-16
Published: · Updated:

California-based semiconductor company Aeluma said it signed a letter of intent for up to $30 million with the Commerce Department’s CHIPS R&D Office.
The company said the proposed support would fund development and commercialization of photonics for AI and advanced computing. A letter of intent is not a finalized award. Aeluma also reported a new strategic agreement with Sumitomo Chemical Advanced Technologies to expand wafer capacity; no capacity figure was given.
Data
Aeluma signs CHIPS letter of intent for up to $30 million in AI photonics
California-based semiconductor company Aeluma said it signed a letter of intent for up to $30 million with the Commerce Department’s CHIPS R&D Office.
- · Occurred
Aeluma signs CHIPS letter of intent for up to $30 million in AI photonics
California-based semiconductor company Aeluma said it signed a letter of intent for up to $30 million with the Commerce Department’s CHIPS R&D Office.
Methodology
Source: Aeluma’s September 16, 2026 release. The US$30 million is the maximum stated in a letter of intent with the CHIPS R&D Office, subject to definitive award negotiations; it is not a finalized payment.
Updated:
Aeluma signs CHIPS letter of intent for up to $30 million in AI photonics
California-based semiconductor company Aeluma said it signed a letter of intent for up to $30 million with the Commerce Department’s CHIPS R&D Office.
- Maximum support stated in CHIPS letter of intent
- ≤30 million USD
- 2026-09-16 · Target
Methodology
Source: Aeluma’s September 16, 2026 release. The US$30 million is the maximum stated in a letter of intent with the CHIPS R&D Office, subject to definitive award negotiations; it is not a finalized payment.
Updated:
Subjects and places
Subject proposals
- Artificial intelligenceSuggested
- Subject suggested from the title or summary: AIwww.sec.gov ↗
- Research and developmentSuggested
- Subject suggested from the title or summary: R&Dwww.sec.gov ↗
- Semiconductor and electronic componentSuggested
- Subject suggested from the title or summary: semiconductorwww.sec.gov ↗
Geographic references
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- United States · Place role: Coverage · Place type: Country or area · Location precision: RegionalEvidence
- Explicit preserved editorial country/region; no city or national centroid inferredwww.sec.gov ↗