# Great Lakes Semiconductor starts first ChipForge project > The project combines chips, memory, sensors and additive packaging for AI-enabled vehicle sensing. - Canonical URL: https://newsverum.com/en/news/great-lakes-semiconductor-chipforge-first-innovation-funnel-project-2026 - Publisher: Newsverum - Section: Technology - Country: United States - Published: 2026-10-15T16:53:09+00:00 - Updated: 2026-10-15T16:53:09+00:00 - Event / data period: 2026-10-14 - Other editions: [Türkçe](https://newsverum.com/tr/news/great-lakes-semiconductor-chipforge-first-innovation-funnel-project-2026.md), [العربية](https://newsverum.com/ar/news/great-lakes-semiconductor-chipforge-first-innovation-funnel-project-2026.md), [Français](https://newsverum.com/fr/news/great-lakes-semiconductor-chipforge-first-innovation-funnel-project-2026.md), [Español](https://newsverum.com/es/news/great-lakes-semiconductor-chipforge-first-innovation-funnel-project-2026.md), [Deutsch](https://newsverum.com/de/news/great-lakes-semiconductor-chipforge-first-innovation-funnel-project-2026.md), [Português](https://newsverum.com/pt/news/great-lakes-semiconductor-chipforge-first-innovation-funnel-project-2026.md) New York-based Great Lakes Semiconductor (GLS) announced the first project under its Innovation Funnel initiative on the Great American ChipForge platform. It brings together GLS design centers, modular wafer fabrication and FINPAT packaging and test for an AI-enabled sensor system aimed at vehicle applications. Partner APES will develop an additively manufactured package substrate to combine GLS and ferroelectric-memory company FMC semiconductors with BlueDot sensor devices. The announcement describes a project and prototyping pathway, not a completed product, volume production or independently measured performance. ## Data ### The project combines company chips and partner sensors in an additively manufactured package substrate. The announcement describes project and prototype work; volume production has not begun. Methodology: This event record summarizes the primary announcement; it is not independent verification of product performance. | date | label | description | status | |---|---|---|---| | 2026-10-14 | The project combines company chips and partner sensors in an additively manufactured package substrate. | The announcement describes project and prototype work; volume production has not begun. | occurred | Sources: · Download data: [JSON](https://newsverum.com/api/v1/articles/great-lakes-semiconductor-chipforge-first-innovation-funnel-project-2026/data/reported-announcement?lang=en&format=json) · [CSV](https://newsverum.com/api/v1/articles/great-lakes-semiconductor-chipforge-first-innovation-funnel-project-2026/data/reported-announcement?lang=en&format=csv) ## Sources - [Great Lakes Semiconductor (PR Newswire)]() (Source checked: 2026-10-15; Published: 2026-10-14) --- Cite the canonical URL above. [Editorial standards and corrections](https://newsverum.com/en/editorial)