# FormFactor and Teradyne announce semiconductor-test collaboration > Teradyne also agreed to a $300 million strategic investment in FormFactor, subject to closing conditions and approvals. - Canonical URL: https://newsverum.com/en/news/formfactor-teradyne-semiconductor-test-collaboration-investment-2026 - Publisher: Newsverum - Section: Technology - Country: United States - Published: 2026-10-15T16:53:08+00:00 - Updated: 2026-10-15T16:53:08+00:00 - Event / data period: 2026-10-12 - Other editions: [Türkçe](https://newsverum.com/tr/news/formfactor-teradyne-semiconductor-test-collaboration-investment-2026.md), [العربية](https://newsverum.com/ar/news/formfactor-teradyne-semiconductor-test-collaboration-investment-2026.md), [Français](https://newsverum.com/fr/news/formfactor-teradyne-semiconductor-test-collaboration-investment-2026.md), [Español](https://newsverum.com/es/news/formfactor-teradyne-semiconductor-test-collaboration-investment-2026.md), [Deutsch](https://newsverum.com/de/news/formfactor-teradyne-semiconductor-test-collaboration-investment-2026.md), [Português](https://newsverum.com/pt/news/formfactor-teradyne-semiconductor-test-collaboration-investment-2026.md) FormFactor and Teradyne announced a technology collaboration to advance semiconductor test architectures for advanced packaging, high-bandwidth memory, silicon photonics and high-performance computing. FormFactor’s probing, interface and characterization expertise will be combined with Teradyne’s automated test platforms. Teradyne separately agreed to make a $300 million strategic equity investment in FormFactor. The collaboration aims to support production readiness and shared customer work; the investment remains subject to customary closing conditions and regulatory approvals. ## Data ### FormFactor and Teradyne will combine test expertise for advanced packaging, HBM, silicon photonics and HPC. The investment is subject to closing conditions and regulatory approvals. Methodology: This event record summarizes the primary announcement; it is not independent verification of product performance. | date | label | description | status | |---|---|---|---| | 2026-10-12 | FormFactor and Teradyne will combine test expertise for advanced packaging, HBM, silicon photonics and HPC. | The investment is subject to closing conditions and regulatory approvals. | occurred | Sources: · Download data: [JSON](https://newsverum.com/api/v1/articles/formfactor-teradyne-semiconductor-test-collaboration-investment-2026/data/reported-announcement?lang=en&format=json) · [CSV](https://newsverum.com/api/v1/articles/formfactor-teradyne-semiconductor-test-collaboration-investment-2026/data/reported-announcement?lang=en&format=csv) ### FormFactor and Teradyne will combine test expertise for advanced packaging, HBM, silicon photonics and HPC. The investment is subject to closing conditions and regulatory approvals. Methodology: This event record summarizes the primary announcement; it is not independent verification of product performance. | Item | Announced amount | |---|---| | Equity investment subject to closing conditions and regulatory approvals | 300 | Sources: · Download data: [JSON](https://newsverum.com/api/v1/articles/formfactor-teradyne-semiconductor-test-collaboration-investment-2026/data/conditional-investment?lang=en&format=json) · [CSV](https://newsverum.com/api/v1/articles/formfactor-teradyne-semiconductor-test-collaboration-investment-2026/data/conditional-investment?lang=en&format=csv) ## Sources - [FormFactor, Inc. and Teradyne, Inc.]() (Source checked: 2026-10-15; Published: 2026-10-12) --- Cite the canonical URL above. [Editorial standards and corrections](https://newsverum.com/en/editorial)