# U.S. redirects GlobalFoundries CHIPS award toward photonics, SiGe and advanced packaging > The U.S. Commerce Department agreed to amend GlobalFoundries’ existing CHIPS award. The change reallocates up to $955 million in incentives to manufacturing investments at its Malta, New York, and Burlington, Vermont facilities; the total award does not increase. - Canonical URL: https://newsverum.com/en/news/commerce-globalfoundries-chips-award-photonics-sige-packaging - Publisher: Newsverum - Section: Technology - Country: United States - Published: 2026-10-15T09:48:29+00:00 - Updated: 2026-10-15T09:48:29+00:00 - Event / data period: 2026-10-14 - Other editions: [Türkçe](https://newsverum.com/tr/news/commerce-globalfoundries-chips-award-photonics-sige-packaging.md), [العربية](https://newsverum.com/ar/news/commerce-globalfoundries-chips-award-photonics-sige-packaging.md), [Français](https://newsverum.com/fr/news/commerce-globalfoundries-chips-award-photonics-sige-packaging.md), [Español](https://newsverum.com/es/news/commerce-globalfoundries-chips-award-photonics-sige-packaging.md), [Deutsch](https://newsverum.com/de/news/commerce-globalfoundries-chips-award-photonics-sige-packaging.md), [Português](https://newsverum.com/pt/news/commerce-globalfoundries-chips-award-photonics-sige-packaging.md) The company’s investment commitment at the facilities rises to $5 billion. The department said the funding will support silicon photonics, silicon-germanium and a first U.S.-based source of silicon interposers for advanced packaging. This is a reallocation of existing CHIPS incentives, not an increase in the award. The department’s announcement describes expansion activity and an investment plan; it does not say the capacity additions are complete. ## Data ### Award amendment The Commerce Department reallocated funds in GlobalFoundries’ existing CHIPS award to U.S. semiconductor manufacturing investments. Methodology: The event is the Commerce Department’s award-amendment announcement dated October 14, 2026. The total award remains unchanged; stated amounts refer to incentive allocation and the company’s investment commitment. | date | label | description | status | |---|---|---|---| | 2026-10-14 | U.S. redirects GlobalFoundries CHIPS award toward photonics, SiGe and advanced packaging | The Commerce Department reallocated funds in GlobalFoundries’ existing CHIPS award to U.S. semiconductor manufacturing investments. | occurred | Sources: · Download data: [JSON](https://newsverum.com/api/v1/articles/commerce-globalfoundries-chips-award-photonics-sige-packaging/data/announcement?lang=en&format=json) · [CSV](https://newsverum.com/api/v1/articles/commerce-globalfoundries-chips-award-photonics-sige-packaging/data/announcement?lang=en&format=csv) ### Incentive allocation and investment commitment The Commerce Department reallocated funds in GlobalFoundries’ existing CHIPS award to U.S. semiconductor manufacturing investments. Methodology: The event is the Commerce Department’s award-amendment announcement dated October 14, 2026. The total award remains unchanged; stated amounts refer to incentive allocation and the company’s investment commitment. | label | value | unit | period | basis | value_qualifier | |---|---|---|---|---|---| | Upper limit of reallocated incentives | 955 | million USD | 2026-10-14 | observed | upper-bound | | Company investment commitment at the two facilities | 5 | billion USD | 2026-10-14 | target | | Sources: · Download data: [JSON](https://newsverum.com/api/v1/articles/commerce-globalfoundries-chips-award-photonics-sige-packaging/data/announced-funding?lang=en&format=json) · [CSV](https://newsverum.com/api/v1/articles/commerce-globalfoundries-chips-award-photonics-sige-packaging/data/announced-funding?lang=en&format=csv) ## Sources - [U.S. Department of Commerce / NIST]() (Source checked: 2026-10-15; Published: 2026-10-14) --- Cite the canonical URL above. [Editorial standards and corrections](https://newsverum.com/en/editorial)