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Es verbindet GLS-Designzentren, modulare Waferfertigung und FINPAT-Packaging und Test für ein KI-gestütztes Sensorsystem im Fahrzeugbereich.","Partner APES entwickelt ein additiv gefertigtes Packaging-Substrat, das GLS- und FMC-Speicherchips mit BlueDot-Sensoren verbinden soll. 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